Inventor
YAMAMICHI SHINTARO
JP66 patents
⚠️ This page may combine multiple inventors who share the name “YAMAMICHI SHINTARO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
27 patentsUS8004074B2Aug 23, 2011
Semiconductor device and fabrication method
NEC CORP53 citations98
US6818469B2Nov 16, 2004
Thin film capacitor, method for manufacturing the same and printed circuit board incorporating the same
NEC CORP71 citations98
US6524905B2Feb 25, 2003
Semiconductor device, and thin film capacitor
NEC CORP76 citations98
US6225133B1May 1, 2001
Method of manufacturing thin film capacitor
NEC CORP138 citations98
US6515324B2Feb 4, 2003
Capacitor, capacitor mounting structure, method for manufacturing same, semiconductor device, and method for manufacturing same
NEC CORP59 citations96
US5262920ANov 16, 1993
Thin film capacitor
NEC CORP75 citations96
US5366920ANov 22, 1994
Method for fabricating a thin film capacitor
NEC CORP94 citations94
US8039756B2Oct 18, 2011
Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same
NEC CORP20 citations93
US7791186B2Sep 7, 2010
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same
NEC CORP17 citations93
US5847423ADec 8, 1998
Semiconductor device having a thin film capacitor and a resistance measuring element
NEC CORP30 citations93
US6703705B2Mar 9, 2004
Semiconductor device and method for packaging same
NEC CORP31 citations92
US5539613AJul 23, 1996
Compact semiconductor device including a thin film capacitor of high reliability
NEC CORP27 citations92
US5943547AAug 24, 1999
Method of forming highly-integrated thin film capacitor with high dielectric constant layer
NEC CORP26 citations89
US5883781AMar 16, 1999
Highly-integrated thin film capacitor with high dielectric constant layer
NEC CORP24 citations89
US7880295B2Feb 1, 2011
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same
NEC CORP9 citations84
US7838779B2Nov 23, 2010
Wiring board, method for manufacturing same, and semiconductor package
NEC CORP16 citations84
US7348673B2Mar 25, 2008
Semiconductor device
NEC CORP13 citations84
US8035217B2Oct 11, 2011
Semiconductor device and method for manufacturing same
NEC CORP9 citations83
US6292352B1Sep 18, 2001
Thin film capacitor
NEC CORP11 citations74
US5670408ASep 23, 1997
Thin film capacitor with small leakage current and method for fabricating the same
NEC CORP14 citations74
US5530279AJun 25, 1996
Thin film capacitor with small leakage current and method for fabricating the same
NEC CORP10 citations74
US5332684AJul 26, 1994
Method for fabricating thin-film capacitor with restrained leakage current at side and end portions of electrodes in a semiconductor integrated circuit device
NEC CORP16 citations74
US8050050B2Nov 1, 2011
Wiring board, semiconductor device, and method of manufacturing the same
NEC CORP2 citations63
US8004085B2Aug 23, 2011
Semiconductor device and method of manufacturing semiconductor device
NEC CORP4 citations63
US6949815B2Sep 27, 2005
Semiconductor device with decoupling capacitors mounted on conductors
NEC CORP4 citations63
US7999401B2Aug 16, 2011
Semiconductor device and method of manufacturing same
NEC CORP6 citations62
US7816782B2Oct 19, 2010
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package
NEC CORP4 citations62
KIKUCHI KATSUMI
6 patentsUS8072073B2Dec 6, 2011
Semiconductor device and method of manufacturing same
KIKUCHI KATSUMI23 citations91
US8766440B2Jul 1, 2014
Wiring board with built-in semiconductor element
KIKUCHI KATSUMI9 citations83
US8710639B2Apr 29, 2014
Semiconductor element-embedded wiring substrate
KIKUCHI KATSUMI11 citations83
US8692364B2Apr 8, 2014
Semiconductor device and method for manufacturing the same
KIKUCHI KATSUMI2 citations62
US8552570B2Oct 8, 2013
Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor device
KIKUCHI KATSUMI3 citations62
US8536691B2Sep 17, 2013
Semiconductor device and method for manufacturing the same
KIKUCHI KATSUMI4 citations60
RENESAS ELECTRONICS CORP
5 patentsUS7911038B2Mar 22, 2011
Wiring board, semiconductor device using wiring board and their manufacturing methods
RENESAS ELECTRONICS CORP7 citations84
US9324663B2Apr 26, 2016
Semiconductor device including a plurality of magnetic shields
RENESAS ELECTRONICS CORP8 citations81
US9117814B2Aug 25, 2015
Semiconductor device
RENESAS ELECTRONICS CORP4 citations73
US10098179B2Oct 9, 2018
Electronic device
RENESAS ELECTRONICS CORP4 citations72
US9172028B2Oct 27, 2015
Semiconductor device
RENESAS ELECTRONICS CORP3 citations62
MORI KENTARO
3 patentsUS8569892B2Oct 29, 2013
Semiconductor device and manufacturing method thereof
MORI KENTARO41 citations93
US8304915B2Nov 6, 2012
Semiconductor device and method for manufacturing the same
MORI KENTARO12 citations84
US8810008B2Aug 19, 2014
Semiconductor element-embedded substrate, and method of manufacturing the substrate
MORI KENTARO3 citations62
NEC ELECTRONICS CORP
3 patentsUS7745736B2Jun 29, 2010
Interconnecting substrate and semiconductor device
NEC ELECTRONICS CORP15 citations84
US7649749B2Jan 19, 2010
Wiring substrate, semiconductor device, and method of manufacturing the same
NEC ELECTRONICS CORP10 citations84
US7674989B2Mar 9, 2010
Wiring board and method for manufacturing the same
NEC ELECTRONICS CORP2 citations62
FUNAYA TAKUO
1 patentMURAI HIDEYA
1 patentNAKASHIMA YOSHIKI
1 patentWATANABE TAKAHITO
1 patentIBM
1 patentIIZUKA TOSHIHIRO
1 patentShowing the top 50 of 66 patents by PatentIndex Score.