P

Inventor

ARIGA MAIKO

JP20 patents
⚠️ This page may combine multiple inventors who share the name “ARIGA MAIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FURUKAWA ELECTRIC CO LTD

19 patents
US7891885B2Feb 22, 2011

Optical module

FURUKAWA ELECTRIC CO LTD12 citations81
US10558063B2Feb 11, 2020

Optical module

FURUKAWA ELECTRIC CO LTD6 citations68
US12274039B2Apr 8, 2025

Optical module and method of manufacturing optical module

FURUKAWA ELECTRIC CO LTD1 citations62
US7974327B2Jul 5, 2011

Surface emitting laser element array

FURUKAWA ELECTRIC CO LTD4 citations62
US11903125B2Feb 13, 2024

Optical module

FURUKAWA ELECTRIC CO LTD0 citations60
US11367993B2Jun 21, 2022

Lid portion and semiconductor laser module

FURUKAWA ELECTRIC CO LTD0 citations60
US10886693B2Jan 5, 2021

Optical module

FURUKAWA ELECTRIC CO LTD0 citations60
US10811840B2Oct 20, 2020

Laser module

FURUKAWA ELECTRIC CO LTD1 citations60
US12468096B2Nov 11, 2025

Optical device and method for manufacturing optical device

FURUKAWA ELECTRIC CO LTD0 citations50
US12326603B2Jun 10, 2025

Optical module using a capacitor to suppress warpage

FURUKAWA ELECTRIC CO LTD0 citations50
US12191627B2Jan 7, 2025

Optical module

FURUKAWA ELECTRIC CO LTD0 citations50
US12066657B2Aug 20, 2024

Optical module

FURUKAWA ELECTRIC CO LTD0 citations50
US11677210B2Jun 13, 2023

Semiconductor laser module

FURUKAWA ELECTRIC CO LTD0 citations50
US11552455B2Jan 10, 2023

Semiconductor laser module

FURUKAWA ELECTRIC CO LTD0 citations50
US11283234B2Mar 22, 2022

Optical module

FURUKAWA ELECTRIC CO LTD0 citations50
US9466942B2Oct 11, 2016

Optical element module

FURUKAWA ELECTRIC CO LTD0 citations50
US11031746B2Jun 8, 2021

Semiconductor laser module

FURUKAWA ELECTRIC CO LTD0 citations49
US11545814B2Jan 3, 2023

Semiconductor laser module and method of manufacturing semiconductor laser module

FURUKAWA ELECTRIC CO LTD0 citations48
US10869395B2Dec 15, 2020

Flexible substrate, flexible substrate-attached component, and manufacturing method of flexible substrate-attached component

FURUKAWA ELECTRIC CO LTD0 citations39

ARIGA MAIKO

1 patent