Inventor

CHEN KEI-WEI

TW202 patents

⚠️ This page may combine multiple inventors who share the name “CHEN KEI-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN KEI-WEI

TAIWAN SEMICONDUCTOR MFG CO LTD

Method for fabricating fin field effect transistor and semiconductor device

Methods of forming a FinFET device

Fin Field-Effect Transistor device and method of forming the same

Polishing pad having grooves on bottom surface of top layer

Method for controlling chemical mechanical polishing process

FinFET device and method of forming the same

Semiconductor device and method

Semiconductor structure and manufacturing method thereof

FinFET structure and method for manufacturing thereof

Method for wafer backside polishing

Gate structure, semiconductor device and the method of forming semiconductor device

Fin field-effect transistor device and method of forming the same

Chemical mechanical polishing apparatus and method

Fin-type field effect transistor

Semiconductor device including fin structures and manufacturing method thereof

Fin field effect transistor and method for fabricating the same

Fin-type field effect transistor structure and manufacturing method thereof

Semiconductor device including fin structures and manufacturing method thereof

Wafer edge trimming tool using abrasive tape

Semiconductor method and device

Thin film metrology

Methods of forming an abrasive slurry and methods for chemical- mechanical polishing

Thin film metrology

Metal loss prevention using implantation

Semiconductor structure with doped contact plug and method for forming the same

CMP system and method of use

Methods of forming an abrasive slurry and methods for chemical-mechanical polishing

Semiconductor device and method for manufacturing the same

Metal loss prevention using implantation

Epitaxy in semiconductor structure and manufacturing method thereof

Chemical mechanical polishing apparatus including a multi-zone platen

Chemical mechanical planarization tool

Chemical mechanical polishing cleaning system with temperature control for defect reduction

Temperature control in chemical mechanical polish

TAIWAN SEMICONDUCTOR MFG

Removal of SiON residue after CMP

Apparatuses for electrochemical deposition, conductive layer, and fabrication methods thereof

Method of reducing the pattern effect in the CMP process

Current-leveling electroplating/electropolishing electrode

Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishing

Resistive random-access memory (RRAM) with multi-layer device structure

Method and system for slurry usage reduction in chemical mechanical polishing

Dry etching gas and method of manufacturing semiconductor device

Method to reduce Rs pattern dependence effect

KUO CHUN-TING

Methods for minimizing edge peeling in the manufacturing of BSI chips

Wafer edge trim blade with slots

Modular grinding apparatuses and methods for wafer thinning

CHEN KEI-WEI

Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene process

CHANG SHIH-CHIEH

Via/contact and damascene structures and manufacturing methods thereof

CHANG SHIH CHIEH

Semiconductor device contact structures and methods for making the same

CHEN YUAN HSUAN

Wafer thinning apparatus having feedback control and method of using