Inventor
UDHAYAKUMAR SUDHARSHAN SUGAVANESH
US3 patents
Patents
3 patentsUS11955406B2Apr 9, 2024
Temperature control element utilized in device die packages
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US12568821B2Mar 3, 2026
Pin fin placement assembly for forming temperature control element utilized in device die packages
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US12424509B2Sep 23, 2025
Compliant pad spacer for three-dimensional integrated circuit package
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