Inventor
LEE CHENG-WEI
TW13 patents
⚠️ This page may combine multiple inventors who share the name “LEE CHENG-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
3 patentsUS6479376B1Nov 12, 2002
Process improvement for the creation of aluminum contact bumps
TAIWAN SEMICONDUCTOR MFG29 citations91
US6458683B1Oct 1, 2002
Method for forming aluminum bumps by CVD and wet etch
TAIWAN SEMICONDUCTOR MFG25 citations91
US6730602B2May 4, 2004
Method for forming aluminum bumps by sputtering and chemical mechanical polishing
TAIWAN SEMICONDUCTOR MFG0 citations40
DAXIN MATERIALS CORP
3 patentsUS10703945B2Jul 7, 2020
Method for temporary bonding workpiece and adhesive
DAXIN MATERIALS CORP2 citations68
US11794381B2Oct 24, 2023
Laser-debondable composition, laminate thereof, and laser-debonding method
DAXIN MATERIALS CORP0 citations55
US12043770B2Jul 23, 2024
Temporary bonding composition, temporary bonding film, composite film, temporary bonding method and semiconductor wafer package
DAXIN MATERIALS CORP0 citations44