Inventor
MURAKAMI HISATOSHI
JP9 patents
⚠️ This page may combine multiple inventors who share the name “MURAKAMI HISATOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TATSUTA DENSEN KK
8 patentsUS5981043ANov 9, 1999
Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield
TATSUTA DENSEN KK74 citations94
US4789411ADec 6, 1988
Conductive copper paste composition
TATSUTA DENSEN KK52 citations94
US7214419B2May 8, 2007
Conductive paste multilayered board including the conductive paste and process for producing the same
TATSUTA DENSEN KK20 citations92
US5736070AApr 7, 1998
Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield
TATSUTA DENSEN KK27 citations91
US5341274AAug 23, 1994
Printed circuit board with enhanced EMI suppression
TATSUTA DENSEN KK31 citations91
US5779941AJul 14, 1998
1,2-N-acyl-N-methylene-ethylenediamine, and electroconductive paste comprising it
TATSUTA DENSEN KK8 citations73
US5466893ANov 14, 1995
Printed circuit board having enhanced EMI suppression
TATSUTA DENSEN KK18 citations72
US5449863ASep 12, 1995
Printed circuit board
TATSUTA DENSEN KK11 citations72