Inventor
KIKUCHI KATSUMI
JP89 patents
⚠️ This page may combine multiple inventors who share the name “KIKUCHI KATSUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
28 patentsUS7338884B2Mar 4, 2008
Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device
NEC CORP286 citations99
US8004074B2Aug 23, 2011
Semiconductor device and fabrication method
NEC CORP53 citations98
US7397000B2Jul 8, 2008
Wiring board and semiconductor package using the same
NEC CORP54 citations96
US6861757B2Mar 1, 2005
Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device
NEC CORP55 citations96
US6278153B1Aug 21, 2001
Thin film capacitor formed in via
NEC CORP62 citations96
US8039756B2Oct 18, 2011
Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same
NEC CORP20 citations93
US7791186B2Sep 7, 2010
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same
NEC CORP17 citations93
US7566834B2Jul 28, 2009
Wiring board and semiconductor package using the same
NEC CORP17 citations92
US7474538B2Jan 6, 2009
Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor package
NEC CORP22 citations92
US7294393B2Nov 13, 2007
Sheet material and wiring board
NEC CORP22 citations92
US6841862B2Jan 11, 2005
Semiconductor package board using a metal base
NEC CORP33 citations92
US7880295B2Feb 1, 2011
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same
NEC CORP9 citations84
US7838779B2Nov 23, 2010
Wiring board, method for manufacturing same, and semiconductor package
NEC CORP16 citations84
US7696007B2Apr 13, 2010
Semiconductor package board using a metal base
NEC CORP8 citations84
US7348673B2Mar 25, 2008
Semiconductor device
NEC CORP13 citations84
US12010371B2Jun 11, 2024
Information processing apparatus, video distribution system, information processing method, and recording medium
NEC CORP4 citations72
US8050050B2Nov 1, 2011
Wiring board, semiconductor device, and method of manufacturing the same
NEC CORP2 citations63
US8004085B2Aug 23, 2011
Semiconductor device and method of manufacturing semiconductor device
NEC CORP4 citations63
US7585699B2Sep 8, 2009
Semiconductor package board using a metal base
NEC CORP2 citations63
US12543511B2Feb 3, 2026
Quantum device
NEC CORP0 citations62
US12300079B2May 13, 2025
Processing system, processing method, and non-transitory storage medium
NEC CORP0 citations62
US11935373B2Mar 19, 2024
Processing system, processing method, and non-transitory storage medium
NEC CORP0 citations62
US7816782B2Oct 19, 2010
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package
NEC CORP4 citations62
US12588530B2Mar 24, 2026
Quantum device
NEC CORP0 citations61
US12108690B2Oct 1, 2024
Quantum device
NEC CORP0 citations61
US11871682B2Jan 9, 2024
Quantum device and method of manufacturing the same
NEC CORP0 citations61
US11798895B2Oct 24, 2023
Quantum device including shield part and method of manufacturing the same
NEC CORP0 citations61
US11696517B2Jul 4, 2023
Quantum device and method of manufacturing the same
NEC CORP0 citations61
KIKUCHI KATSUMI
5 patentsUS8072073B2Dec 6, 2011
Semiconductor device and method of manufacturing same
KIKUCHI KATSUMI23 citations91
US8766440B2Jul 1, 2014
Wiring board with built-in semiconductor element
KIKUCHI KATSUMI9 citations83
US8710639B2Apr 29, 2014
Semiconductor element-embedded wiring substrate
KIKUCHI KATSUMI11 citations83
US8692364B2Apr 8, 2014
Semiconductor device and method for manufacturing the same
KIKUCHI KATSUMI2 citations62
US8552570B2Oct 8, 2013
Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor device
KIKUCHI KATSUMI3 citations62
NEC ELECTRONICS CORP
4 patentsUS7060604B2Jun 13, 2006
Multilayer wiring substrate, and method of producing same
NEC ELECTRONICS CORP21 citations92
US7649749B2Jan 19, 2010
Wiring substrate, semiconductor device, and method of manufacturing the same
NEC ELECTRONICS CORP10 citations84
US7233066B2Jun 19, 2007
Multilayer wiring substrate, and method of producing same
NEC ELECTRONICS CORP8 citations73
US7674989B2Mar 9, 2010
Wiring board and method for manufacturing the same
NEC ELECTRONICS CORP2 citations62
PANASONIC IP MAN CO LTD
2 patentsPANASONIC CORP
2 patentsMORI KENTARO
2 patentsSUBARU CORP
2 patentsMATSUSHITA ELECTRIC WORKS LTD
1 patentFUJI HEAVY IND LTD
1 patentRENESAS ELECTRONICS CORP
1 patentMURAI HIDEYA
1 patentNAKASHIMA YOSHIKI
1 patentShowing the top 50 of 89 patents by PatentIndex Score.