Inventor
OSHIMA HIROKI
JP18 patents
⚠️ This page may combine multiple inventors who share the name “OSHIMA HIROKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOYOTA JIDOSHOKKI KK
10 patentsUS9590239B2Mar 7, 2017
Negative electrode for nonaqueous secondary battery, method for producing the same, and nonaqueous secondary battery
TOYOTA JIDOSHOKKI KK2 citations68
US10446838B2Oct 15, 2019
Negative electrode for nonaqueous secondary battery and nonaqueous secondary battery, negative electrode active material and method for producing same, complex including nano silicon, carbon layer, and cationic polymer layer, and method for producing complex formed of nano silicon and carbon layer
TOYOTA JIDOSHOKKI KK1 citations61
US10476073B2Nov 12, 2019
Production process for carbon-coated silicon material
TOYOTA JIDOSHOKKI KK1 citations60
US10347910B2Jul 9, 2019
Nano silicon material, method for producing same, and negative electrode of secondary battery
TOYOTA JIDOSHOKKI KK0 citations51
US10559813B2Feb 11, 2020
Negative electrode for nonaqueous electrolyte secondary battery and nonaqueous electrolyte secondary battery
TOYOTA JIDOSHOKKI KK0 citations50
US10308515B2Jun 4, 2019
Method for producing CaSi2-containing composition and silicon material
TOYOTA JIDOSHOKKI KK0 citations50
US10217990B2Feb 26, 2019
Silicon material and negative electrode of secondary battery
TOYOTA JIDOSHOKKI KK0 citations50
US10164255B2Dec 25, 2018
Silicon material and negative electrode of secondary battery
TOYOTA JIDOSHOKKI KK0 citations50
US9685660B2Jun 20, 2017
Positive electrode for lithium-ion secondary battery and production process for the same, and lithium-ion secondary battery
TOYOTA JIDOSHOKKI KK0 citations45
US9876232B2Jan 23, 2018
Positive electrode for secondary battery, method for producing the same, and nonaqueous secondary battery
TOYOTA JIDOSHOKKI KK0 citations40
SENJU METAL INDUSTRY CO
4 patentsUS10722965B2Jul 28, 2020
Solder ball supplying method, solder ball supplying device, and solder bump forming method
SENJU METAL INDUSTRY CO2 citations72
US10111342B2Oct 23, 2018
Solder transfer sheet, solder bump, and solder precoating method using solder transfer sheet
SENJU METAL INDUSTRY CO2 citations71
US10780530B2Sep 22, 2020
Solder ball, solder joint, and joining method
SENJU METAL INDUSTRY CO1 citations59
US9669493B2Jun 6, 2017
Layered solder material for bonding different species of electrodes and method of bonding the different species of electrodes in an electronic component
SENJU METAL INDUSTRY CO0 citations35