Inventor
ROGERS WILLIAM BOYD
US8 patents
⚠️ This page may combine multiple inventors who share the name “ROGERS WILLIAM BOYD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DECA TECHNOLOGIES INC
7 patentsUS9159547B2Oct 13, 2015
Two step method of rapid curing a semiconductor polymer layer
DECA TECHNOLOGIES INC20 citations89
US10050004B2Aug 14, 2018
Fully molded peripheral package on package device
DECA TECHNOLOGIES INC8 citations83
US9613830B2Apr 4, 2017
Fully molded peripheral package on package device
DECA TECHNOLOGIES INC2 citations72
US9640495B2May 2, 2017
Semiconductor device processing method for material removal
DECA TECHNOLOGIES INC3 citations69
US10600652B2Mar 24, 2020
Semiconductor device processing method for material removal
DECA TECHNOLOGIES INC1 citations59
US10204803B2Feb 12, 2019
Two step method of rapid curing a semiconductor polymer layer
DECA TECHNOLOGIES INC0 citations49
US10672624B2Jun 2, 2020
Method of making fully molded peripheral package on package device
DECA TECHNOLOGIES INC0 citations41