Inventor
AN MIN CHEOL
KR4 patents
Patents
4 patentsUS5744827AApr 28, 1998
Three dimensional stack package device having exposed coupling lead portions and vertical interconnection elements
SAMSUNG ELECTRONICS CO LTD312 citations97
US5804874ASep 8, 1998
Stacked chip package device employing a plurality of lead on chip type semiconductor chips
SAMSUNG ELECTRONICS CO LTD146 citations96
US6028774AFeb 22, 2000
Base cards and IC cards using the same
SAMSUNG ELECTRONICS CO LTD80 citations91
US6104095AAug 15, 2000
Printed circuit board and chip-on-board packages using same
SAMSUNG ELECTRONICS CO LTD25 citations89