Inventor

MUKOJIMA HITOSHI

JP5 patents

Patents

5 patents

US6361831B1Mar 26, 2002

Paste application method for die bonding

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD50 citations94

US7191511B2Mar 20, 2007

Electronic component placement machine having camera units with vertically overlaid apertures

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD16 citations82

US7007377B2Mar 7, 2006

Electronic component placement method

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD10 citations71

US6348234B1Feb 19, 2002

Paste applying method

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD13 citations71

US6685777B2Feb 3, 2004

Paste applicator and paste application method for die bonding

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD1 citations50