Inventor
SHIOZAWA SHIGERU
JP7 patents
Patents
7 patentsUS6595400B2Jul 22, 2003
Wire bonding apparatus
SHINKAWA KK8 citations73
US6527027B2Mar 4, 2003
Single-point bonding apparatus
SHINKAWA KK11 citations73
US6419138B1Jul 16, 2002
Device conveying a carrier tape used for electronic components
SHINKAWA KK10 citations73
US5975835ANov 2, 1999
Lead frame conveying method and conveying apparatus
SHINKAWA KK9 citations70
US6645346B2Nov 11, 2003
Workpiece holding device for a bonding apparatus
SHINKAWA KK6 citations62
US6129255AOct 10, 2000
Wire bonding apparatus
SHINKAWA KK5 citations61
US6793066B2Sep 21, 2004
Conveying apparatus for plate-form members
SHINKAWA KK0 citations48