Inventor

RIVET STEVEN R

US4 patents

⚠️ This page may combine multiple inventors who share the name “RIVET STEVEN R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

Intersil Americas LLC

2 patents

US10290618B2May 14, 2019

Back-to-back stacked dies

Intersil Americas LLC1 citations58

US10582617B2Mar 3, 2020

Method of fabricating a circuit module

Intersil Americas LLC0 citations45

HEBERT FRANCOIS

1 patent

US9524957B2Dec 20, 2016

Back-to-back stacked dies

HEBERT FRANCOIS12 citations80

YIN JIAN

1 patent

US9717146B2Jul 25, 2017

Circuit module such as a high-density lead frame array (HDA) power module, and method of making same

YIN JIAN0 citations45