Inventor
HATABE MASARU
JP8 patents
Patents
8 patentsUS12388035B2Aug 12, 2025
Structure comprising under barrier metal and solder layer, and method for producing structure
ISHIHARA CHEMICAL CO LTD0 citations60
US11946153B2Apr 2, 2024
Copper or copper alloy electroplating bath
ISHIHARA CHEMICAL CO LTD0 citations56
US11052637B2Jul 6, 2021
Structure containing Sn layer or Sn alloy layer
ISHIHARA CHEMICAL CO LTD0 citations54
US12448690B2Oct 21, 2025
Treatment method after plating with Sn or Sn alloy
ISHIHARA CHEMICAL CO LTD0 citations49
US12519071B2Jan 6, 2026
Structure containing Sn layer or Sn alloy layer
ISHIHARA CHEMICAL CO LTD0 citations45
US11993862B2May 28, 2024
Structure including copper plating layer or copper alloy plating layer
ISHIHARA CHEMICAL CO LTD0 citations45
US11939691B2Mar 26, 2024
Tin or tin alloy electroplating bath, and electronic component having electrodeposit formed thereon using the plating bath
ISHIHARA CHEMICAL CO LTD0 citations41
US10062657B2Aug 28, 2018
Method for manufacturing alloy bump
ISHIHARA CHEMICAL CO LTD0 citations32