Inventor
CHIEN WEI-MING
US13 patents
⚠️ This page may combine multiple inventors who share the name “CHIEN WEI-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
XINTEC INC
10 patentsUS11310904B2Apr 19, 2022
Chip package and power module
XINTEC INC0 citations62
US9331256B2May 3, 2016
Semiconductor structure with sensor chip and landing pads
XINTEC INC2 citations62
US11355659B2Jun 7, 2022
Chip package and manufacturing method thereof
XINTEC INC0 citations61
US9450015B2Sep 20, 2016
Manufacturing method of semiconductor structure
XINTEC INC0 citations52
US10096635B2Oct 9, 2018
Semiconductor structure and manufacturing method thereof
XINTEC INC1 citations51
US9780251B2Oct 3, 2017
Semiconductor structure and manufacturing method thereof
XINTEC INC0 citations51
US9640683B2May 2, 2017
Electrical contact structure with a redistribution layer connected to a stud
XINTEC INC1 citations51
US9613919B2Apr 4, 2017
Chip package and method for forming the same
XINTEC INC0 citations51
US12500141B2Dec 16, 2025
Semiconductor device structure and semiconductor package assembly
XINTEC INC0 citations50
US9214579B2Dec 15, 2015
Electrical contact structure with a redistribution layer connected to a stud
XINTEC INC0 citations41