Inventor

KATAGIRI MITSUAKI

JP63 patents

⚠️ This page may combine multiple inventors who share the name “KATAGIRI MITSUAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KATAGIRI MITSUAKI

ELPIDA MEMORY INC

Semiconductor device

Inductance analysis system and method and program therefor

Semiconductor stack package having wiring extension part which has hole for wiring

Semiconductor device

Semiconductor device

Semiconductor device

Method for designing semiconductor apparatus, system for aiding to design semiconductor apparatus, computer program product therefor and semiconductor package

Fine pitch grid array type semiconductor device

Semiconductor device

Stacked-type semiconductor package

Method for manufacturing semiconductor device, semiconductor device and apparatus comprising same

Stacked-type semiconductor package

Semiconductor device

Semiconductor device including semiconductor chips with different thickness

Semiconductor device

Semiconductor device

Semiconductor device and stacked semiconductor device

Semiconductor device having improved solder joint and internal lead lifetimes

RENESAS TECH CORP

Semiconductor integrated circuit device and its manufacturing method

Wafer level chip size package having rerouting layers

Semiconductor device

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and manufacturing method of that

Semiconductor integrated circuit device

MICRON TECHNOLOGY INC

Apparatuses comprising semiconductor dies in face-to-face arrangements

Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods and devices

Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatuses

Apparatuses comprising semiconductor dies in face-to-face arrangements

Apparatuses comprising semiconductor dies in face-to-face arrangements

HITACHI LTD

Multichip package or system-in package

Semiconductor integrated circuit

Semiconductor device and method for manufacturing the same

DRAM stacked package, DIMM, and semiconductor manufacturing method

Semiconductor integrated circuit

PS4 LUXCO SARL

Semiconductor device

Semiconductor package with bonding wires of reduced loop inductance

Device having electrodes formed from bumps with different diameters

Semiconductor device

Semiconductor device stack with bonding layer and wire retaining member

TAKEDA HIROMASA

Semiconductor device

Semiconductor device

WATANABE YUJI

BGA semiconductor device having a dummy bump

BGA semiconductor device having a dummy bump

HASEGAWA YU

Semiconductor device stack with bonding layer and wire retaining member

Semiconductor device

HITACHI LTD INTELLECTUAL PROPE

Semiconductor storage device having a plurality of stacked memory chips

NEC CORP

Semiconductor device, noise reduction method, and shield cover

ITAYA SATOSHI

Semiconductor device with additional power supply paths