Inventor
YONEYAMA REI
JP36 patents
⚠️ This page may combine multiple inventors who share the name “YONEYAMA REI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
34 patentsUSD766851SSep 20, 2016
Semiconductor device
MITSUBISHI ELECTRIC CORP43 citations97
USD773412SDec 6, 2016
Semiconductor device
MITSUBISHI ELECTRIC CORP34 citations94
USD773413SDec 6, 2016
Semiconductor device
MITSUBISHI ELECTRIC CORP31 citations94
USD767516SSep 27, 2016
Semiconductor device
MITSUBISHI ELECTRIC CORP35 citations94
US9418975B1Aug 16, 2016
Semiconductor module, power conversion device, and method for manufacturing semiconductor module
MITSUBISHI ELECTRIC CORP29 citations94
USD864884SOct 29, 2019
Semiconductor device
MITSUBISHI ELECTRIC CORP27 citations93
USD759604SJun 21, 2016
Semiconductor device
MITSUBISHI ELECTRIC CORP21 citations92
USD873227SJan 21, 2020
Semiconductor device
MITSUBISHI ELECTRIC CORP11 citations85
USD783549SApr 11, 2017
Semiconductor device
MITSUBISHI ELECTRIC CORP6 citations84
US10116302B1Oct 30, 2018
Semiconductor device
MITSUBISHI ELECTRIC CORP8 citations83
US9613888B2Apr 4, 2017
Semiconductor device and semiconductor module
MITSUBISHI ELECTRIC CORP13 citations82
US10714447B2Jul 14, 2020
Electrode terminal, semiconductor device, and power conversion apparatus
MITSUBISHI ELECTRIC CORP2 citations73
US10727150B2Jul 28, 2020
Semiconductor module and power converter
MITSUBISHI ELECTRIC CORP2 citations72
US10366964B2Jul 30, 2019
Semiconductor device having switching elements to prevent overcurrent damage
MITSUBISHI ELECTRIC CORP2 citations72
US9578754B2Feb 21, 2017
Metal base substrate, power module, and method for manufacturing metal base substrate
MITSUBISHI ELECTRIC CORP2 citations72
US10771053B2Sep 8, 2020
Semiconductor device having first and second switching regions respectively controlled by first and second control signals output by a controller
MITSUBISHI ELECTRIC CORP5 citations71
US10290555B2May 14, 2019
Semiconductor device including sensor and driving terminals spaced away from the semiconductor device case wall
MITSUBISHI ELECTRIC CORP2 citations69
US9406624B2Aug 2, 2016
Semiconductor module and power converter
MITSUBISHI ELECTRIC CORP2 citations63
US12500135B2Dec 16, 2025
Semiconductor device comprising semiconductor element; insulating component; lead electrode; and first bonding material, second bonding material, third bonding material, and fourth bonding material made of a same material
MITSUBISHI ELECTRIC CORP0 citations62
US10325825B2Jun 18, 2019
Semiconductor apparatus
MITSUBISHI ELECTRIC CORP1 citations62
US9252087B2Feb 2, 2016
Electronic circuit, production method thereof, and electronic component
MITSUBISHI ELECTRIC CORP2 citations61
US11680979B2Jun 20, 2023
Semiconductor device
MITSUBISHI ELECTRIC CORP0 citations59
US11114836B2Sep 7, 2021
Semiconductor device, intelligent power module and power conversion apparatus
MITSUBISHI ELECTRIC CORP0 citations57
US9774112B2Sep 26, 2017
Press-fit terminal, semiconductor device, power conversion apparatus and method of manufacturing press-fit terminal
MITSUBISHI ELECTRIC CORP0 citations52
US9653369B2May 16, 2017
Power semiconductor module comprising a case, base plate, and spacer
MITSUBISHI ELECTRIC CORP0 citations52
US10453780B2Oct 22, 2019
Electronic circuit, production method thereof, and electronic component
MITSUBISHI ELECTRIC CORP0 citations51
US9159676B2Oct 13, 2015
Semiconductor module
MITSUBISHI ELECTRIC CORP0 citations51
US11581307B2Feb 14, 2023
Semiconductor device
MITSUBISHI ELECTRIC CORP0 citations49
US11183834B2Nov 23, 2021
Semiconductor module and power conversion apparatus having a diode bridge circuit and a protection circuit
MITSUBISHI ELECTRIC CORP0 citations49
US10861756B2Dec 8, 2020
Semiconductor device including sensor and driving terminals spaced away from the semiconductor device case wall
MITSUBISHI ELECTRIC CORP0 citations48
US9627293B2Apr 18, 2017
Semiconductor device and heat-conductive sheet
MITSUBISHI ELECTRIC CORP0 citations48
US10338128B2Jul 2, 2019
Life estimation circuit and semiconductor device made using the same
MITSUBISHI ELECTRIC CORP0 citations40
US10062632B2Aug 28, 2018
Semiconductor device having improved heat dissipation efficiency
MITSUBISHI ELECTRIC CORP0 citations39
US9723718B2Aug 1, 2017
Electronic component mounting device and semiconductor device including the same
MITSUBISHI ELECTRIC CORP0 citations37