Inventor
CHIANG CHIA-WEI
TW5 patents
⚠️ This page may combine multiple inventors who share the name “CHIANG CHIA-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
POWERTECH TECHNOLOGY INC
4 patentsUS10593629B2Mar 17, 2020
Semiconductor package with a conductive casing for heat dissipation and electromagnetic interference (EMI) shield and manufacturing method thereof
POWERTECH TECHNOLOGY INC9 citations82
US10607860B2Mar 31, 2020
Package structure and chip structure
POWERTECH TECHNOLOGY INC2 citations71
US10431549B2Oct 1, 2019
Semiconductor package and manufacturing method thereof
POWERTECH TECHNOLOGY INC2 citations71
US10276510B2Apr 30, 2019
Manufacturing method of package structure having conductive shield
POWERTECH TECHNOLOGY INC4 citations71