Inventor
LIN JI-CHENG
TW11 patents
⚠️ This page may combine multiple inventors who share the name “LIN JI-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
POWERTECH TECHNOLOGY INC
5 patentsUS10607860B2Mar 31, 2020
Package structure and chip structure
POWERTECH TECHNOLOGY INC2 citations71
US10276510B2Apr 30, 2019
Manufacturing method of package structure having conductive shield
POWERTECH TECHNOLOGY INC4 citations71
US9825010B2Nov 21, 2017
Stacked chip package structure and manufacturing method thereof
POWERTECH TECHNOLOGY INC4 citations71
US7691676B1Apr 6, 2010
Mold array process for semiconductor packages
POWERTECH TECHNOLOGY INC3 citations61
US10950557B2Mar 16, 2021
Stacked chip package structure and manufacturing method thereof
POWERTECH TECHNOLOGY INC0 citations50
IND TECH RES INST
4 patentsUS7754599B2Jul 13, 2010
Structure for reducing stress for vias and fabricating method thereof
IND TECH RES INST2 citations61
US7531900B2May 12, 2009
Package structure for electronic device
IND TECH RES INST3 citations61
US7378746B2May 27, 2008
Composite bump
IND TECH RES INST0 citations50
US7545039B2Jun 9, 2009
Structure for reducing stress for vias and fabricating method thereof
IND TECH RES INST0 citations48