Inventor
CHU CHE-MIN
TW10 patents
⚠️ This page may combine multiple inventors who share the name “CHU CHE-MIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
POWERTECH TECHNOLOGY INC
6 patentsUS10607860B2Mar 31, 2020
Package structure and chip structure
POWERTECH TECHNOLOGY INC2 citations71
US10276510B2Apr 30, 2019
Manufacturing method of package structure having conductive shield
POWERTECH TECHNOLOGY INC4 citations71
US9825010B2Nov 21, 2017
Stacked chip package structure and manufacturing method thereof
POWERTECH TECHNOLOGY INC4 citations71
US8853834B2Oct 7, 2014
Leadframe-type semiconductor package having EMI shielding layer connected to ground
POWERTECH TECHNOLOGY INC1 citations51
US10950557B2Mar 16, 2021
Stacked chip package structure and manufacturing method thereof
POWERTECH TECHNOLOGY INC0 citations50
US8541870B1Sep 24, 2013
Semiconductor package utilizing tape to reinforce fixing of leads to die pad
POWERTECH TECHNOLOGY INC0 citations50