Inventor
LIN CHUN-TE
TW30 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHUN-TE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ACER INC
13 patentsUSD939024SDec 21, 2021
Electronic gaming cabin
ACER INC8 citations83
USD1038114SAug 6, 2024
Notebook computer
ACER INC3 citations75
USD1041465SSep 10, 2024
Notebook computer
ACER INC2 citations73
USD1024021SApr 23, 2024
Controller
ACER INC2 citations72
USD955383SJun 21, 2022
Computer host
ACER INC5 citations72
USD935399SNov 9, 2021
Wireless charging stand for catholic smart rosary
ACER INC5 citations72
USD1072975SApr 29, 2025
Exercise equipment
ACER INC1 citations63
USD1113906SFeb 17, 2026
Notebook computer
ACER INC0 citations62
USD1111531SFeb 10, 2026
Table board
ACER INC0 citations62
USD1108415SJan 6, 2026
Notebook computer
ACER INC0 citations62
USD1078748SJun 10, 2025
Mouse pad
ACER INC0 citations62
USD1032583SJun 25, 2024
Router
ACER INC1 citations62
USD1022973SApr 16, 2024
Antenna
ACER INC1 citations62
POWERTECH TECHNOLOGY INC
8 patentsUS10607860B2Mar 31, 2020
Package structure and chip structure
POWERTECH TECHNOLOGY INC2 citations71
US10276510B2Apr 30, 2019
Manufacturing method of package structure having conductive shield
POWERTECH TECHNOLOGY INC4 citations71
US9825010B2Nov 21, 2017
Stacked chip package structure and manufacturing method thereof
POWERTECH TECHNOLOGY INC4 citations71
US11694950B2Jul 4, 2023
Semiconductor package
POWERTECH TECHNOLOGY INC0 citations56
US11133291B2Sep 28, 2021
Chip package structure with multi-chip stack
POWERTECH TECHNOLOGY INC0 citations56
US11302539B2Apr 12, 2022
Semiconductor packaging structure and method for packaging semiconductor device
POWERTECH TECHNOLOGY INC0 citations50
US10950557B2Mar 16, 2021
Stacked chip package structure and manufacturing method thereof
POWERTECH TECHNOLOGY INC0 citations50
US11362055B2Jun 14, 2022
Bump structure of the semiconductor package
POWERTECH TECHNOLOGY INC0 citations45
MOSEL VITELIC INC
4 patentsUS7358168B2Apr 15, 2008
Ion implantation method for forming a shallow junction
MOSEL VITELIC INC2 citations54
US6743075B2Jun 1, 2004
Method for determining chemical mechanical polishing time
MOSEL VITELIC INC6 citations54
US7344998B2Mar 18, 2008
Wafer recovering method, wafer, and fabrication method
MOSEL VITELIC INC1 citations49
US7192789B2Mar 20, 2007
Method for monitoring an ion implanter
MOSEL VITELIC INC0 citations34