Inventor
TSENG CHUNG-BIN
TW11 patents
Patents
11 patentsUS10269684B2Apr 23, 2019
Semiconductor structure and manufacuting method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US11430909B2Aug 30, 2022
BSI chip with backside alignment mark
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US9691809B2Jun 27, 2017
Backside illuminated image sensor device having an oxide film and method of forming an oxide film of a backside illuminated image sensor device
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US9831154B2Nov 28, 2017
Semiconductor structure and manufacuting method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12094997B2Sep 17, 2024
BSI chip with backside alignment mark
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10163646B2Dec 25, 2018
Method for forming semiconductor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US9583356B1Feb 28, 2017
Method for forming semiconductor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US10658269B2May 19, 2020
Semiconductor structure and manufacturing method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10056316B2Aug 21, 2018
Manufacuting method of semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10665466B2May 26, 2020
Method for forming semiconductor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10008530B2Jun 26, 2018
Image sensing device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41