Inventor
Pu Yingjiang
CN6 patents
Patents
6 patentsUS12266583B2Apr 1, 2025
Flip chip package unit and associated packaging method
CHENGDU MONOLITHIC POWER SYS0 citations57
US12002787B2Jun 4, 2024
Multi-die package structure and multi-die co-packing method
CHENGDU MONOLITHIC POWER SYS0 citations50
US12159792B2Dec 3, 2024
Flip chip package unit comprising thermal protection film and associated packaging method
CHENGDU MONOLITHIC POWER SYS0 citations47
US11824001B2Nov 21, 2023
Integrated circuit package structure and integrated circuit package unit
CHENGDU MONOLITHIC POWER SYS0 citations47
US11670600B2Jun 6, 2023
Panel level metal wall grids array for integrated circuit packaging
CHENGDU MONOLITHIC POWER SYS0 citations47
US11616017B2Mar 28, 2023
Integrated circuit package structure, integrated circuit package unit and associated packaging method
CHENGDU MONOLITHIC POWER SYS0 citations47