Inventor · disambiguated record
Stanford W. Crane, Jr.
Also filed as: CRANE JR STANFORD W · CRANE STANFORD W · CRANE STANFORD W JR
67 granted patents·13 pending applications·1,981 citations·filing 1989–2010
99Inventor score
Files withSILICON BANDWIDTH INC37PANDA PROJECT18THE PANDA PROJECT4PANDA PROJECT INC2QUANTUM LEAP PACKAGING INC2
Top patents by PatentIndex Score
80 records- 0197US5634821AHigh-density electrical interconnect systemFiled 1995·Granted Jun 3, 1997·118 cites·81 claims
- 0296US6905367B2Modular coaxial electrical interconnect system having a modular frame and electrically shielded signal paths and a method of making the sameSILICON BANDWIDTH INC·Filed 2002·Granted Jun 14, 2005·107 cites·75 claims
- 0395US5543586AApparatus having inner layers supporting surface-mount componentsPANDA PROJECT·Filed 1994·Granted Aug 6, 1996·167 cites·22 claims
- 0493US5637019AElectrical interconnect system having insulative shrouds for preventing mismatingPANDA PROJECT·Filed 1994·Granted Jun 10, 1997·86 cites·18 claims
- 0591US5575688AHigh-density electrical interconnect systemFiled 1995·Granted Nov 19, 1996·97 cites·66 claims
- 0690US6461197B2Female contact pin including flexible contact portionSILICON BANDWIDTH INC·Filed 2001·Granted Oct 8, 2002·47 cites·5 claims
- 0789US6663294B2Optoelectronic packaging assemblySILICON BANDWIDTH INC·Filed 2001·Granted Dec 16, 2003·43 cites·71 claims
- 0889USD369923SComputer cabinetTHE PANDA PROJECT·Filed 1994·Granted May 21, 1996·34 cites·1 claims
- 0984US6577003B1Semiconductor chip carrier affording a high-density external interfaceSILICON BANDWIDTH INC·Filed 2000·Granted Jun 10, 2003·25 cites·29 claims
- 1084USD430565SComputer cabinetSILICON BANDWIDTH INC·Filed 1997·Granted Sep 5, 2000·30 cites·1 claims
- 1183US7123465B2Decoupling capacitor for an integrated circuit and method of manufacturing thereofSILICON BANDWIDTH INC·Filed 2004·Granted Oct 17, 2006·30 cites·21 claims
- 1283US6700138B2Modular semiconductor die package and method of manufacturing thereofSILICON BANDWIDTH INC·Filed 2002·Granted Mar 2, 2004·27 cites·21 claims
- 1383US5696027AMethod of manufacturing a semiconductor chip carrier affording a high-density external interfacePANDA PROJECT·Filed 1995·Granted Dec 9, 1997·46 cites·31 claims
- 1482US6574726B2Modular architecture for high bandwidth computersSILICON BANDWIDTH INC·Filed 2000·Granted Jun 3, 2003·20 cites·20 claims
- 1582USD363707SComputer cabinetTHE PANDA PROJECT·Filed 1994·Granted Oct 31, 1995·23 cites·1 claims
- 1681US7803020B2Backplane system having high-density electrical connectorsCRANE JR STANFORD W·Filed 2007·Granted Sep 28, 2010·9 cites·20 claims
- 1781US6203347B1High-density electrical interconnect systemSILICON BANDWIDTH INC·Filed 1999·Granted Mar 20, 2001·27 cites·23 claims
- 1880US6050850AElectrical connector having staggered hold-down tabsPANDA PROJECT·Filed 1997·Granted Apr 18, 2000·30 cites·33 claims
- 1979US6305987B1Integrated connector and semiconductor die packageSILICON BANDWIDTH INC·Filed 1999·Granted Oct 23, 2001·32 cites·29 claims
- 2079US5541449ASemiconductor chip carrier affording a high-density external interfacePANDA PROJECT·Filed 1994·Granted Jul 30, 1996·40 cites·26 claims
- 2178US7070340B2High performance optoelectronic packaging assemblySILICON BANDWIDTH INC·Filed 2002·Granted Jul 4, 2006·20 cites·65 claims
- 2278US6016256AMulti-chip module having interconnect diesPANDA PROJECT·Filed 1997·Granted Jan 18, 2000·44 cites·31 claims
- 2377US6603193B2Semiconductor packageSILICON BANDWIDTH INC·Filed 2001·Granted Aug 5, 2003·28 cites·47 claims
- 2477US6334794B1Electrical connector having staggered hold-down tabsSILICON BANDWIDTH INC·Filed 1999·Granted Jan 1, 2002·26 cites·18 claims
- 2577US5967850AHigh-density electrical interconnect systemFiled 1996·Granted Oct 19, 1999·24 cites·69 claims
- 2677US5659953AMethod of manufacturing an apparatus having inner layers supporting surface-mount componentsPANDA PROJECT·Filed 1995·Granted Aug 26, 1997·45 cites·26 claims
- 2776US6421254B2Multi-chip module having interconnect diesSILICON BANDWIDTH INC·Filed 2001·Granted Jul 16, 2002·19 cites·20 claims
- 2876US4932902AUltra-high density electrical interconnect systemCRANE ELECTRONICS·Filed 1989·Granted Jun 12, 1990·33 cites·36 claims
- 2975US6307258B1Open-cavity semiconductor die packageSILICON BANDWIDTH INC·Filed 1998·Granted Oct 23, 2001·38 cites·24 claims
- 3075US5941617ADecorative panel for computer enclosurePANDA PROJECT·Filed 1997·Granted Aug 24, 1999·34 cites·21 claims
- 3174US5781408AComputer system having a motorized door mechanismPANDA PROJECT·Filed 1996·Granted Jul 14, 1998·60 cites·23 claims
- 3273US6073229AComputer system having a modular architecturePANDA PROJECT·Filed 1997·Granted Jun 6, 2000·22 cites·23 claims
- 3373US6031720ACooling system for semiconductor die carrierPANDA PROJECT·Filed 1997·Granted Feb 29, 2000·47 cites·17 claims
- 3472US6797882B1Die package for connection to a substrateSILICON BANDWIDTH INC·Filed 2001·Granted Sep 28, 2004·16 cites·29 claims
- 3572US5641309AHigh-density electrical interconnect systemFiled 1995·Granted Jun 24, 1997·24 cites·52 claims
- 3671US6339191B1Prefabricated semiconductor chip carrierSILICON BANDWIDTH INC·Filed 1994·Granted Jan 15, 2002·28 cites·150 claims
- 3771US5951665AInterface optimized computer system architecturePANDA PROJECT·Filed 1997·Granted Sep 14, 1999·34 cites·37 claims
- 3870US6977432B2Prefabricated semiconductor chip carrierQUANTUM LEAP PACKAGING INC·Filed 2004·Granted Dec 20, 2005·11 cites·12 claims
- 3970US5822551APassive backplane capable of being configured to a variable data path width corresponding to a data size of the pluggable CPU boardPANDA PROJECT·Filed 1996·Granted Oct 13, 1998·38 cites·71 claims
- 4069US5819403AMethod of manufacturing a semiconductor chip carrierPANDA PROJECT·Filed 1995·Granted Oct 13, 1998·24 cites·78 claims
- 4169US5812797AComputer having a high density connector systemPANDA PROJECT·Filed 1996·Granted Sep 22, 1998·34 cites·8 claims
- 4267US6097086ASemiconductor chip carrier including an interconnect component interfaceSILICON BANDWIDTH INC·Filed 1999·Granted Aug 1, 2000·21 cites·21 claims
- 4367US6078102ASemiconductor die package for mounting in horizontal and upright configurationsSILICON BANDWIDTH INC·Filed 1998·Granted Jun 20, 2000·34 cites·35 claims
- 4465US7253365B2Die package for connection to a substrateQUANTUM LEAP PACKAGING INC·Filed 2004·Granted Aug 7, 2007·11 cites·25 claims
- 4565US7103753B2Backplane system having high-density electrical connectorsSILICON BANDWITH INC·Filed 2003·Granted Sep 5, 2006·7 cites·52 claims
- 4664US6857173B1Apparatus for and method of manufacturing a semiconductor die carrierSILICON BANDWIDTH INC·Filed 2000·Granted Feb 22, 2005·9 cites·28 claims
- 4764US6847115B2Packaged semiconductor device for radio frequency shieldingSILICON BANDWIDTH INC·Filed 2001·Granted Jan 25, 2005·13 cites·15 claims
- 4863US6266246B1Multi-chip module having interconnect diesSILICON BANDWIDTH INC·Filed 2000·Granted Jul 24, 2001·9 cites·12 claims
- 4962US7183646B2Semiconductor chip carrier affording a high-density external interfaceSILICON BANDWIDTH INC·Filed 2003·Granted Feb 27, 2007·6 cites·17 claims
- 5062US6679733B2Electrical connector having electrically conductive shieldingSILICON BANDWIDTH INC·Filed 2001·Granted Jan 20, 2004·9 cites·20 claims
Showing the top 50 of 80 patent records by PatentIndex Score.
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