Inventor

LEE JONG UNG

KR2 patents

⚠️ This page may combine multiple inventors who share the name “LEE JONG UNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

1 patent

US7235887B2Jun 26, 2007

Semiconductor package with improved chip attachment and manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD16 citations79

JANG JIN WOOK

1 patent

US8829748B2Sep 9, 2014

Connecting molding for automation of three-phase motor winding

JANG JIN WOOK0 citations31