Inventor
MIREMADI JIAN
US5 patents
⚠️ This page may combine multiple inventors who share the name “MIREMADI JIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD ENTPR DEV LP
3 patentsUS10833438B1Nov 10, 2020
Apparatus for surface mount connectors
HEWLETT PACKARD ENTPR DEV LP3 citations69
US11705652B2Jul 18, 2023
Apparatus for surface mount connectors
HEWLETT PACKARD ENTPR DEV LP0 citations59
US11927436B2Mar 12, 2024
Measurement machine and method for detecting a defect in solder joints
HEWLETT PACKARD ENTPR DEV LP0 citations43