Inventor
WANG TZU-HSUAN
TW12 patents
⚠️ This page may combine multiple inventors who share the name “WANG TZU-HSUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNIMICRON TECHNOLOGY CORP
7 patentsUS11430768B2Aug 30, 2022
Stacked die chip package structure and method of manufacturing the same
UNIMICRON TECHNOLOGY CORP2 citations62
US10998258B2May 4, 2021
Circuit carrier and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations59
US10943846B2Mar 9, 2021
Chip package structure with heat conductive component and manufacturing thereof
UNIMICRON TECHNOLOGY CORP1 citations56
US12253727B2Mar 18, 2025
Electronic device
UNIMICRON TECHNOLOGY CORP0 citations50
US11937366B2Mar 19, 2024
Circuit signal enhancement method of circuit board and structure thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US10964634B2Mar 30, 2021
Method of manufacturing circuit carrier with embedded semiconductor substrate
UNIMICRON TECHNOLOGY CORP0 citations46
US10629511B2Apr 21, 2020
Heat dissipation substrate, manufacturing method thereof and chip package structure
UNIMICRON TECHNOLOGY CORP0 citations40
AMULAIRE THERMAL TECH INC
4 patentsUS11037857B1Jun 15, 2021
IGBT module with heat dissipation structure having copper layers of different thicknesses
AMULAIRE THERMAL TECH INC2 citations71
US11302601B1Apr 12, 2022
IGBT module with heat dissipation structure and method for manufacturing the same
AMULAIRE THERMAL TECH INC1 citations61
US11508642B2Nov 22, 2022
Power module package structure
AMULAIRE THERMAL TECH INC0 citations50
US11081421B2Aug 3, 2021
IGBT module with heat dissipation structure having ceramic layers corresponding in position and in area to chips
AMULAIRE THERMAL TECH INC0 citations50