Inventor
WEICHART JUERGEN
LI20 patents
⚠️ This page may combine multiple inventors who share the name “WEICHART JUERGEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
WEICHART JUERGEN
6 patentsUS10784092B2Sep 22, 2020
Reactive sputtering with HIPIMs
WEICHART JUERGEN2 citations70
US8268142B2Sep 18, 2012
RF sputtering arrangement
WEICHART JUERGEN3 citations59
US8613828B2Dec 24, 2013
Procedure and device for the production of a plasma
WEICHART JUERGEN2 citations55
US9719177B2Aug 1, 2017
In-situ conditioning for vacuum processing of polymer substrates
WEICHART JUERGEN1 citations51
US8691058B2Apr 8, 2014
Apparatus for sputtering and a method of fabricating a metallization structure
WEICHART JUERGEN0 citations46
US8852412B2Oct 7, 2014
Magnetron source and method of manufacturing
WEICHART JUERGEN0 citations40
UNAXIS BALZERS AG
3 patentsUS6814838B2Nov 9, 2004
Vacuum treatment chamber and method for treating surfaces
UNAXIS BALZERS AG20 citations92
US6432492B2Aug 13, 2002
HF-Plasma coating chamber or PECVD coating chamber, its use and method of plating CDs using the chamber
UNAXIS BALZERS AG7 citations73
US6312574B1Nov 6, 2001
Target, magnetron source with said target and process for producing said target
UNAXIS BALZERS AG3 citations60
KADLEC STANISLAV
3 patentsUS8574409B2Nov 5, 2013
Method of magnetron sputtering and a method for determining a power modulation compensation function for a power supply applied to a magnetron sputtering source
KADLEC STANISLAV18 citations89
US8435389B2May 7, 2013
RF substrate bias with high power impulse magnetron sputtering (HIPIMS)
KADLEC STANISLAV7 citations82
US8246794B2Aug 21, 2012
Method of magnetron sputtering and a method for determining a power modulation compensation function for a power supply applied to a magnetron sputtering source
KADLEC STANISLAV1 citations49