Inventor · disambiguated record
Eric Cornelis Egbertus Van Grunsven
Also filed as: VAN GRUNSVEN ERIC · VAN GRUNSVEN ERIC C E · VAN GRUNSVEN ERIC CORNELIS EGB · VAN GRUNSVEN ERIC CORNELIS EGBERTUS
10 granted patents·8 pending applications·33 citations·filing 2003–2023
84Inventor score
Files withKONINKL PHILIPS ELECTRONICS NV5PHILIPS LIGHTING HOLDING BV4KONINKLIJKE PHILIPS NV2SIGNIFY HOLDING BV2GULPEN JAN1
Top patents by PatentIndex Score
18 records- 0183US8416047B2Inductive components for DC/DC converters and methods of manufacture thereofWEEKAMP JOHANNES WILHELMUS·Filed 2010·Granted Apr 9, 2013·6 cites·20 claims
- 0280US7704881B2Producing a covered through substrate via using a temporary cap layerNXP BV·Filed 2006·Granted Apr 27, 2010·11 cites·26 claims
- 0373US8395267B2Through-substrate via and redistribution layer with metal pasteROOZEBOOM FREDDY·Filed 2009·Granted Mar 12, 2013·7 cites·14 claims
- 0468US8138087B2Method of manufacturing an integrated circuitMOREL STEPHANE·Filed 2007·Granted Mar 20, 2012·7 cites·14 claims
- 0565US10107489B2Particulate water-activatable luminescent materialsPHILIPS LIGHTING HOLDING BV·Filed 2015·Granted Oct 23, 2018·1 cites·14 claims
- 0662US9583676B2Low warpage wafer bonding through use of slotted substratesKONINKLIJKE PHILIPS NV·Filed 2012·Granted Feb 28, 2017·1 cites·19 claims
- 0752US10084110B2Low warpage wafer bonding through use of slotted substratesKONINKLIJKE PHILIPS NV·Filed 2017·Granted Sep 25, 2018·0 cites·12 claims
- 0852US2025341293A1Glare reduction for a lighting deviceSIGNIFY HOLDING BV·Filed 2023·Application pending·0 cites
- 0950US9961778B2Liquid immersion transfer of electronicsPHILIPS LIGHTING HOLDING BV·Filed 2015·Granted May 1, 2018·0 cites·13 claims
- 1045US2008298061A1Light Emitting Module and Manufacturing MethodKONINKL PHILIPS ELECTRONICS NV·Filed 2006·Application pending·0 cites
- 1143US12092271B2Optical and thermal improvement of a two-sided multi-channel filamentSIGNIFY HOLDING BV·Filed 2022·Granted Sep 17, 2024·0 cites·15 claims
- 1243US8482136B2Fan-out chip scale packageGULPEN JAN·Filed 2009·Granted Jul 9, 2013·0 cites·23 claims
- 1342US2008265348A1Method of Manufacturing an Image Sensor and Image SensorKONINKL PHILIPS ELECTRONICS NV·Filed 2005·Application pending·0 cites
- 1439US2008278061A1Light Emitting Diode ModuleKONINKL PHILIPS ELECTRONICS NV·Filed 2005·Application pending·0 cites
- 1537US2007052091A1Electronic device and method of manufacturing sameKONINKL PHILIPS ELECTRONICS NV·Filed 2003·Application pending·0 cites
- 1636US2008186550A1Micro Electromechanical Device For Tilting A Body In Two Degrees Of FreedomKONINKL PHILIPS ELECTRONICS NV·Filed 2006·Application pending·0 cites
- 1733US2017294420A1A method of applying a lighting arrangement to a surface and a lighting surfacePHILIPS LIGHTING HOLDING BV·Filed 2015·Application pending·0 cites
- 1832US2017184281A1Conformal coated lighting or lumination systemPHILIPS LIGHTING HOLDING BV·Filed 2015·Application pending·0 cites
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