Inventor
YAMASHITA YOHEI
JP35 patents
⚠️ This page may combine multiple inventors who share the name “YAMASHITA YOHEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO ELECTRON LTD
11 patentsUS12512336B2Dec 30, 2025
Substrate processing method and substrate processing apparatus
TOKYO ELECTRON LTD0 citations61
US12191149B2Jan 7, 2025
Substrate processing method and substrate processing system
TOKYO ELECTRON LTD0 citations61
US12543522B2Feb 3, 2026
Manufacturing method of chip-attached substrate and substrate processing apparatus
TOKYO ELECTRON LTD0 citations60
US12381085B2Aug 5, 2025
Bonded substrate peripheral laser processing method and substrate processing apparatus thereof
TOKYO ELECTRON LTD0 citations60
US12322656B2Jun 3, 2025
Substrate laser processing method and substrate laser processing apparatus
TOKYO ELECTRON LTD0 citations60
US12300495B2May 13, 2025
Processing apparatus and processing method
TOKYO ELECTRON LTD0 citations51
US12103111B2Oct 1, 2024
Processing apparatus and processing method
TOKYO ELECTRON LTD0 citations51
US12525453B2Jan 13, 2026
Processing apparatus and processing method
TOKYO ELECTRON LTD0 citations50
US12397375B2Aug 26, 2025
Processing apparatus and processing method
TOKYO ELECTRON LTD0 citations50
US12070820B2Aug 27, 2024
Processing apparatus and processing method
TOKYO ELECTRON LTD0 citations50
US11969827B2Apr 30, 2024
Processing apparatus and processing method
TOKYO ELECTRON LTD0 citations48
DISCO CORP
10 patentsUS9093519B2Jul 28, 2015
Wafer processing method
DISCO CORP7 citations84
US10049934B2Aug 14, 2018
Wafer processing method
DISCO CORP2 citations72
US7713845B2May 11, 2010
Laser processing method for wafer
DISCO CORP2 citations63
US10985065B2Apr 20, 2021
Method of dicing a wafer by pre-sawing and subsequent laser cutting
DISCO CORP0 citations51
US9698301B2Jul 4, 2017
Wafer processing method
DISCO CORP0 citations41
US10858524B2Dec 8, 2020
Protective film forming resin agent and laser processing method
DISCO CORP0 citations40
US9953871B2Apr 24, 2018
Wafer processing method
DISCO CORP0 citations40
US7799700B2Sep 21, 2010
Method for applying resin film to face of semiconductor wafer
DISCO CORP0 citations39
US9786561B2Oct 10, 2017
Wafer processing method
DISCO CORP0 citations37
US9478465B2Oct 25, 2016
Wafer processing method
DISCO CORP0 citations37
MIZUNO KK
10 patentsUS10561914B2Feb 18, 2020
Baseball or softball bat with modified restitution characteristics
MIZUNO KK7 citations81
US10245488B1Apr 2, 2019
Vibration damping bat and methods of making the same
MIZUNO KK11 citations81
US11524215B2Dec 13, 2022
Bat system with performance limiting structure and methods of making same
MIZUNO KK3 citations72
US10967235B2Apr 6, 2021
Bat system with performance limiting structure and methods of making same
MIZUNO KK2 citations72
US11389703B2Jul 19, 2022
Bat
MIZUNO KK2 citations71
US10507368B2Dec 17, 2019
Baseball or softball bat
MIZUNO KK2 citations66
US12390706B2Aug 19, 2025
Bat system with performance limiting structure and methods of making same
MIZUNO KK0 citations61
US11878222B2Jan 23, 2024
Bat
MIZUNO KK0 citations60
US12194353B2Jan 14, 2025
Bat
MIZUNO KK0 citations50
US9440112B2Sep 13, 2016
Bat selection device and bat selection method
MIZUNO KK0 citations41