Inventor

JANG KEUNHO

KR3 patents

⚠️ This page may combine multiple inventors who share the name “JANG KEUNHO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

2 patents

US10147616B2Dec 4, 2018

Package frame and method of manufacturing semiconductor package using the same

SAMSUNG ELECTRONICS CO LTD3 citations66

US12456671B2Oct 28, 2025

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations53

HYUNDAI MOTOR CO LTD

1 patent

US9759675B2Sep 12, 2017

Particulate matter sensor unit

HYUNDAI MOTOR CO LTD3 citations70