Inventor

GAGNON JAY J

US4 patents

⚠️ This page may combine multiple inventors who share the name “GAGNON JAY J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ALLEGRO MICROSYSTEMS INC

3 patents

US5859387AJan 12, 1999

Semiconductor device leadframe die attach pad having a raised bond pad

ALLEGRO MICROSYSTEMS INC124 citations95

US5289344AFeb 22, 1994

Integrated-circuit lead-frame package with failure-resistant ground-lead and heat-sink means

ALLEGRO MICROSYSTEMS INC115 citations94

US5012322AApr 30, 1991

Semiconductor die and mounting assembly

ALLEGRO MICROSYSTEMS INC86 citations91

SPRAGUE ELECTRIC CO

1 patent

US4916506AApr 10, 1990

Integrated-circuit lead-frame package with low-resistance ground-lead and heat-sink means

SPRAGUE ELECTRIC CO37 citations90