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Inventor
YANG GWI-GYEON
KR
5 patents
⚠️ This page may combine multiple inventors who share the name “YANG GWI-GYEON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FAIRCHILD KR SEMICONDUCTOR LTD
2 patents
US7061080B2
Jun 13, 2006
Power module package having improved heat dissipating capability
FAIRCHILD KR SEMICONDUCTOR LTD
127 citations
98
US7208819B2
Apr 24, 2007
Power module package having improved heat dissipating capability
FAIRCHILD KR SEMICONDUCTOR LTD
69 citations
97
YANG GWI-GYEON
2 patents
US8198139B2
Jun 12, 2012
Power device package and method of fabricating the same
YANG GWI-GYEON
25 citations
88
US8796831B2
Aug 5, 2014
Complex semiconductor packages and methods of fabricating the same
YANG GWI-GYEON
4 citations
69
Fairchild Korea
1 patent
US7846779B2
Dec 7, 2010
Power device package and method of fabricating the same
Fairchild Korea
10 citations
77