P

Inventor

GUPTA ANAND

US69 patents
⚠️ This page may combine multiple inventors who share the name “GUPTA ANAND”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

34 patents
US6125789AOct 3, 2000

Increasing the sensitivity of an in-situ particle monitor

APPLIED MATERIALS INC564 citations99
US6374770B1Apr 23, 2002

Apparatus for improving film stability of halogen-doped silicon oxide films

APPLIED MATERIALS INC184 citations98
US6191026B1Feb 20, 2001

Method for submicron gap filling on a semiconductor substrate

APPLIED MATERIALS INC155 citations98
US5824375AOct 20, 1998

Decontamination of a plasma reactor using a plasma after a chamber clean

APPLIED MATERIALS INC107 citations98
US6449521B1Sep 10, 2002

Decontamination of a plasma reactor using a plasma after a chamber clean

APPLIED MATERIALS INC59 citations96
US6103601AAug 15, 2000

Method and apparatus for improving film stability of halogen-doped silicon oxide films

APPLIED MATERIALS INC64 citations96
US5494523AFeb 27, 1996

Controlling plasma particulates by contouring the plasma sheath using materials of differing RF impedances

APPLIED MATERIALS INC53 citations96
US5456796AOct 10, 1995

Control of particle generation within a reaction chamber

APPLIED MATERIALS INC68 citations95
US6020035AFeb 1, 2000

Film to tie up loose fluorine in the chamber after a clean process

APPLIED MATERIALS INC74 citations94
US5827785AOct 27, 1998

Method for improving film stability of fluorosilicate glass films

APPLIED MATERIALS INC56 citations94
US5622565AApr 22, 1997

Reduction of contaminant buildup in semiconductor apparatus

APPLIED MATERIALS INC54 citations94
US6638886B1Oct 28, 2003

Plasma fluorine resistant alumina ceramic material and method of making

APPLIED MATERIALS INC19 citations93
US6465043B1Oct 15, 2002

Method and apparatus for reducing particle contamination in a substrate processing chamber

APPLIED MATERIALS INC28 citations93
US6139923AOct 31, 2000

Method and apparatus for reducing particle contamination in a substrate processing chamber

APPLIED MATERIALS INC26 citations93
US6083451AJul 4, 2000

Method of producing a polycrystalline alumina ceramic which is resistant to a fluorine-comprising plasma

APPLIED MATERIALS INC18 citations93
US5608155AMar 4, 1997

Method and apparatus for detecting particles on a substrate

APPLIED MATERIALS INC51 citations93
US5427621AJun 27, 1995

Method for removing particulate contaminants by magnetic field spiking

APPLIED MATERIALS INC36 citations93
US5328555AJul 12, 1994

Reducing particulate contamination during semiconductor device processing

APPLIED MATERIALS INC50 citations93
US5902494AMay 11, 1999

Method and apparatus for reducing particle generation by limiting DC bias spike

APPLIED MATERIALS INC25 citations92
US5423918AJun 13, 1995

Method for reducing particulate contamination during plasma processing of semiconductor devices

APPLIED MATERIALS INC37 citations92
US5410122AApr 25, 1995

Use of electrostatic forces to reduce particle contamination in semiconductor plasma processing chambers

APPLIED MATERIALS INC36 citations92
US6223685B1May 1, 2001

Film to tie up loose fluorine in the chamber after a clean process

APPLIED MATERIALS INC32 citations91
US6214160B1Apr 10, 2001

Method and apparatus for removing particulates from semiconductor substrates in plasma processing chambers

APPLIED MATERIALS INC23 citations91
US5779807AJul 14, 1998

Method and apparatus for removing particulates from semiconductor substrates in plasma processing chambers

APPLIED MATERIALS INC41 citations91
US5622595AApr 22, 1997

Reducing particulate contamination during semiconductor device processing

APPLIED MATERIALS INC32 citations91
US6159333ADec 12, 2000

Substrate processing system configurable for deposition or cleaning

APPLIED MATERIALS INC26 citations90
US5810937ASep 22, 1998

Using ceramic wafer to protect susceptor during cleaning of a processing chamber

APPLIED MATERIALS INC28 citations90
US5083865AJan 28, 1992

Particle monitor system and method

APPLIED MATERIALS INC44 citations90
US6083569AJul 4, 2000

Discharging a wafer after a plasma process for dielectric deposition

APPLIED MATERIALS INC19 citations89
US6001728ADec 14, 1999

Method and apparatus for improving film stability of halogen-doped silicon oxide films

APPLIED MATERIALS INC34 citations89
US6289843B1Sep 18, 2001

Method and apparatus for improving the film quality of plasma enhanced CVD films at the interface

APPLIED MATERIALS INC7 citations73
US6291028B1Sep 18, 2001

Method and apparatus for improving the film quality of plasma enhanced CVD films at the interface

APPLIED MATERIALS INC8 citations73
US6121163ASep 19, 2000

Method and apparatus for improving the film quality of plasma enhanced CVD films at the interface

APPLIED MATERIALS INC10 citations73
US5474640ADec 12, 1995

Apparatus for marking a substrate using ionized gas

APPLIED MATERIALS INC9 citations73

PALANTIR TECHNOLOGIES INC

7 patents

SPEEDFAM IPEC CORP

3 patents

REAL TIME METROLOGY INC

1 patent

SPEEDFAM CORP

1 patent

(unassigned)

1 patent

GUPTA ANAND

1 patent

CHEUNG HUGO

1 patent

DEERE & CO

1 patent

Showing the top 50 of 69 patents by PatentIndex Score.