Inventor

HO CHENG-LIN

TW34 patents

⚠️ This page may combine multiple inventors who share the name “HO CHENG-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HO CHENG-LIN

ADVANCED SEMICONDUCTOR ENG

Substrate, semiconductor device package and method of manufacturing the same

Semiconductor package structure and semiconductor process

Semiconductor device package and method of manufacturing the same

Electrical connection placement of semiconductor device package and method of manufacturing the same

Antenna package and method of manufacturing the same

Semiconductor package and semiconductor manufacturing process

Substrate, semiconductor package including the same, and method for manufacturing the same

Reduced-dimension via-land structure and method of making the same

Semiconductor device package, electronic assembly and method for manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package, electronic assembly and method for manufacturing the same

Semiconductor device package and method of manufacturing the same

Substrate, semiconductor device package and method of manufacturing the same

Semiconductor device package, electronic assembly and method for manufacturing the same

Semiconductor device package and method for manufacturing the same

Substrate structure having pad portions

Substrate, semiconductor device package and method of manufacturing the same

Semiconductor substrate, semiconductor package, and method for forming the same

Semiconductor substrate, semiconductor package, and method for forming the same

Semiconductor package with chamfered pads

Semiconductor device package and method of manufacturing the same

Substrate, semiconductor device package and method of manufacturing the same

Semiconductor package structure and semiconductor process

Semiconductor substrate, semiconductor package structure and method of making the same

Semiconductor substrate, semiconductor package structure and method of making the same

Semiconductor device package and a method of manufacturing the same

Semiconductor substrate including embedded component and method of manufacturing the same

RELIANCE INT CORP

Drum pedal and drum pedal unit

Multi-functional and extendable mounting stand and coupling joint thereof

Stand adjustment device

Cable-driven beater mechanism for percussion instrument

Foldable stand

Stand adjustment device

Stand adjustment device