Inventor

CHAI SUCHET P

US2 patents

Patents

2 patents

US6828663B2Dec 7, 2004

Method of packaging a device with a lead frame, and an apparatus formed therefrom

TELEDYNE TECH INC126 citations95

US6507110B1Jan 14, 2003

Microwave device and method for making same

TELEDYNE TECH INC29 citations90