P

Inventor

KATAOKA TAKASHI

JP70 patents
⚠️ This page may combine multiple inventors who share the name “KATAOKA TAKASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUI MINING & SMELTING CO

14 patents
US6270889B1Aug 7, 2001

Making and using an ultra-thin copper foil

MITSUI MINING & SMELTING CO64 citations95
US6660406B2Dec 9, 2003

Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit

MITSUI MINING & SMELTING CO26 citations92
US6319620B1Nov 20, 2001

Making and using an ultra-thin copper foil

MITSUI MINING & SMELTING CO22 citations92
US6183880B1Feb 6, 2001

Composite foil of aluminum and copper

MITSUI MINING & SMELTING CO46 citations92
US6969557B2Nov 29, 2005

Surface-treated copper foil low-dielectric substrate and copper-clad laminate and printed wiring board using the same

MITSUI MINING & SMELTING CO17 citations83
US6902824B2Jun 7, 2005

Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same

MITSUI MINING & SMELTING CO9 citations74
US6548153B2Apr 15, 2003

Composite material used in making printed wiring boards

MITSUI MINING & SMELTING CO10 citations74
US6544663B1Apr 8, 2003

Electrodeposited copper foil

MITSUI MINING & SMELTING CO10 citations68
US6827867B2Dec 7, 2004

Method for manufacturing printed wiring board

MITSUI MINING & SMELTING CO4 citations63
US6716572B2Apr 6, 2004

Manufacturing process for printed wiring board

MITSUI MINING & SMELTING CO5 citations63
US6585877B2Jul 1, 2003

Method of producing a surface-treated copper foil

MITSUI MINING & SMELTING CO4 citations63
US6579437B2Jun 17, 2003

Method of producing a surface-treated copper foil

MITSUI MINING & SMELTING CO3 citations63
US6533915B2Mar 18, 2003

Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil

MITSUI MINING & SMELTING CO4 citations63
US6531045B2Mar 11, 2003

Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil

MITSUI MINING & SMELTING CO2 citations63

NIPPON STEEL CORP

11 patents

PILOT INK CO LTD

7 patents

NISHIKAWA YUKIE

2 patents

NIPPON STEEL & SUMITOMO METAL CORP

2 patents

MITSUI TOATSU CHEMICALS

2 patents

NSK AMERICAS INC

2 patents

HITACHI LTD

1 patent

SHIBAHASHI YUTAKA

1 patent

EBARA CORP

1 patent

NSK LTD

1 patent

KITO TSUTOMU

1 patent

TOSHIBA KK

1 patent

KATAOKA TAKASHI

1 patent

SANYO ELECTRIC CO

1 patent

FUJIFILM CORP

1 patent

TSUKADA TSUTOMU

1 patent

Showing the top 50 of 70 patents by PatentIndex Score.