Inventor
TELLKAMP JOHN PAUL
US16 patents
⚠️ This page may combine multiple inventors who share the name “TELLKAMP JOHN PAUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
15 patentsUS6946856B1Sep 20, 2005
Thermal testing method for integrated circuit chips and packages
TEXAS INSTRUMENTS INC19 citations91
US10892405B2Jan 12, 2021
Hall-effect sensor package with added current path
TEXAS INSTRUMENTS INC2 citations71
US12009336B2Jun 11, 2024
Packages with electrical fuses
TEXAS INSTRUMENTS INC3 citations69
US10439065B2Oct 8, 2019
Inverted leads for packaged isolation devices
TEXAS INSTRUMENTS INC3 citations68
US11569153B2Jan 31, 2023
Leadframes with folded conductor portion and devices therefrom
TEXAS INSTRUMENTS INC0 citations62
US11557722B2Jan 17, 2023
Hall-effect sensor package with added current path
TEXAS INSTRUMENTS INC0 citations61
US7166481B2Jan 23, 2007
Method for evaluating and modifying solder attach design for integrated circuit packaging assembly
TEXAS INSTRUMENTS INC2 citations61
US12293953B2May 6, 2025
Edge bend for isolation packages
TEXAS INSTRUMENTS INC0 citations60
US11574884B2Feb 7, 2023
Multi-function bond pad
TEXAS INSTRUMENTS INC0 citations60
US12548727B2Feb 10, 2026
Packages with electrical fuses
TEXAS INSTRUMENTS INC0 citations57
US12336231B2Jun 17, 2025
Inverted leads for packaged isolation devices
TEXAS INSTRUMENTS INC0 citations57
US11658243B2May 23, 2023
Inverted leads for packaged isolation devices
TEXAS INSTRUMENTS INC0 citations57
US9239353B2Jan 19, 2016
Testing of integrated circuits with external clearance requirements
TEXAS INSTRUMENTS INC0 citations50
US8377747B2Feb 19, 2013
Interleaf for leadframe identification
TEXAS INSTRUMENTS INC0 citations50
US7256117B2Aug 14, 2007
Method for evaluating and modifying solder attach design for integrated circuit packaging assembly
TEXAS INSTRUMENTS INC0 citations50