Inventor
BLUMBERG LAWRENCE ROBERT
US6 patents
Patents
6 patentsUS6136733AOct 24, 2000
Method for reducing coefficient of thermal expansion in chip attach packages
IBM15 citations80
US6841026B2Jan 11, 2005
Method for reducing coefficient of thermal expansion in chip attach packages
IBM6 citations72
US6586352B1Jul 1, 2003
Method for reducing coefficient of thermal expansion in chip attach packages
IBM10 citations72
US6387830B1May 14, 2002
Method for reducing coefficient of thermal expansion in chip attach packages
IBM9 citations72
US5773132AJun 30, 1998
Protecting copper dielectric interface from delamination
IBM13 citations72
US6485892B1Nov 26, 2002
Method for masking a hole in a substrate during plating
IBM4 citations61