Inventor
SUROWKA JOHN FRANK
US5 patents
Patents
5 patentsUS6176985B1Jan 23, 2001
Laminated electroplating rack and connection system for optimized plating
IBM29 citations91
US6136733AOct 24, 2000
Method for reducing coefficient of thermal expansion in chip attach packages
IBM15 citations80
US6841026B2Jan 11, 2005
Method for reducing coefficient of thermal expansion in chip attach packages
IBM6 citations72
US6586352B1Jul 1, 2003
Method for reducing coefficient of thermal expansion in chip attach packages
IBM10 citations72
US6387830B1May 14, 2002
Method for reducing coefficient of thermal expansion in chip attach packages
IBM9 citations72