Inventor
KOO JAEUNG
KR5 patents
Patents
5 patentsUS7452817B2Nov 18, 2008
CMP method providing reduced thickness variations
SAMSUNG ELECTRONICS CO LTD18 citations80
US11094586B2Aug 17, 2021
Semiconductor device including interconnections having different structures and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD3 citations69
US12400907B2Aug 26, 2025
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations46
US12464795B2Nov 4, 2025
Method of manufacturing semiconductor device using single slurry chemical mechanical polishing (CMP) process
SAMSUNG ELECTRONICS CO LTD0 citations44
US12513982B2Dec 30, 2025
Semiconductor device having an isolation structure between adjacent source/drain regions
SAMSUNG ELECTRONICS CO LTD0 citations43