Inventor
TAKASAKI NORIYUKI
JP2 patents
Patents
2 patentsUS6733901B2May 11, 2004
Process for production of epoxy resin composition for semiconductor encapsulation, epoxy resin composition for semiconductor encapsulation, and semiconductor device
SUMITOMO BAKELITE CO7 citations70
US6495260B1Dec 17, 2002
Method of producing epoxy for molding semiconductor device, molding material, and semiconductor device
SUMITOMO BAKELITE CO9 citations65