Inventor
LIN CHIHWEI
TW3 patents
Patents
3 patentsUS7911044B2Mar 22, 2011
RF module package for releasing stress
ADVANCED CHIP ENG TECH INC18 citations82
US7176567B2Feb 13, 2007
Semiconductor device protective structure and method for fabricating the same
ADVANCED CHIP ENG TECH INC10 citations80
US7416920B2Aug 26, 2008
Semiconductor device protective structure and method for fabricating the same
ADVANCED CHIP ENG TECH INC5 citations70