Inventor

DUONG BENJAMIN T

US4 patents

Patents

4 patents

US12546957B2Feb 10, 2026

Photonic integrated circuit packaging architectures

INTEL CORP1 citations60

US11948898B2Apr 2, 2024

Etch barrier for microelectronic packaging conductive structures

INTEL CORP0 citations50

US12249584B2Mar 11, 2025

Microelectronic assemblies having integrated magnetic core inductors

INTEL CORP0 citations49

US12476175B2Nov 18, 2025

Glass substrates having transverse capacitors for use with semiconductor packages and related methods

INTEL CORP0 citations45