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Inventor
YASUE ITARU
JP
2 patents
Patents
2 patents
US4200393A
Apr 29, 1980
Method of positioning a semiconductor member by examining it and a die bonding apparatus using the same
TOKYO SHIBAURA ELECTRIC CO
31 citations
86
US4155650A
May 22, 1979
Micro-article processing system
TOKYO SHIBAURA ELECTRIC CO
10 citations
70