Inventor · disambiguated record
Jing Sua Goh
Also filed as: GOH JING S · GOH JING SUA
12 granted patents·624 citations·filing 1995–2001
94Inventor score
Files withTEXAS INSTRUMENTS INC12
Top patents by PatentIndex Score
12 records- 0195US5952611AFlexible pin location integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1997·Granted Sep 14, 1999·216 cites·19 claims
- 0292US6365833B1Integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2000·Granted Apr 2, 2002·70 cites·7 claims
- 0389US6387729B2Method for adhering and sealing a silicon chip in an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2001·Granted May 14, 2002·48 cites·5 claims
- 0482US5798564AMultiple chip module apparatus having dual sided substrateTEXAS INSTRUMENTS INC·Filed 1996·Granted Aug 25, 1998·67 cites·6 claims
- 0580US6177723B1Integrated circuit package and flat plate molding process for integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1997·Granted Jan 23, 2001·64 cites·9 claims
- 0679US6087203AMethod for adhering and sealing a silicon chip in an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1997·Granted Jul 11, 2000·45 cites·8 claims
- 0767US6236107B1Encapsulate resin LOC package and method of fabricationTEXAS INSTRUMENTS INC·Filed 1995·Granted May 22, 2001·33 cites·12 claims
- 0866US5647124AMethod of attachment of a semiconductor slotted lead to a substrateTEXAS INSTRUMENTS INC·Filed 1995·Granted Jul 15, 1997·29 cites·6 claims
- 0951US6040623ASlotted lead for a semiconductor deviceTEXAS INSTRUMENTS INC·Filed 1997·Granted Mar 21, 2000·15 cites·6 claims
- 1046US6667560B2Board on chip ball grid arrayTEXAS INSTRUMENTS INC·Filed 1997·Granted Dec 23, 2003·13 cites·8 claims
- 1146US6316829B1Reinforced semiconductor packageTEXAS INSTRUMENTS INC·Filed 1998·Granted Nov 13, 2001·18 cites·12 claims
- 1230US5529474ASystem for preheating a molding compoundTEXAS INSTRUMENTS INC·Filed 1995·Granted Jun 25, 1996·6 cites·11 claims
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