Inventor
HOIER MAGDALENA
DE7 patents
Patents
7 patentsUS10242969B2Mar 26, 2019
Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same
INFINEON TECHNOLOGIES AG12 citations83
US10211158B2Feb 19, 2019
Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module
INFINEON TECHNOLOGIES AG3 citations72
US9196510B2Nov 24, 2015
Semiconductor package comprising two semiconductor modules and laterally extending connectors
INFINEON TECHNOLOGIES AG4 citations72
US11322451B2May 3, 2022
Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module
INFINEON TECHNOLOGIES AG0 citations62
US9756726B2Sep 5, 2017
Electronic device and method of fabricating an electronic device
INFINEON TECHNOLOGIES AG0 citations51
US9780053B2Oct 3, 2017
Method of forming a bondpad and bondpad
INFINEON TECHNOLOGIES AG0 citations50
US9924594B2Mar 20, 2018
Power semiconductor module and method for producing a power semiconductor module
INFINEON TECHNOLOGIES AG0 citations39