Inventor

WONG KA SHUN

US2 patents

Patents

2 patents

US6764952B1Jul 20, 2004

Systems and methods to retard copper diffusion and improve film adhesion for a dielectric barrier on copper

NOVELLUS SYSTEMS INC28 citations92

US6777349B2Aug 17, 2004

Hermetic silicon carbide

NOVELLUS SYSTEMS INC28 citations87