Inventor · disambiguated record
Masatsugu Koso
Also filed as: KOSO MASATSUGU
4 granted patents·10 pending applications·0 citations·filing 2011–2020
54Inventor score
Top patents by PatentIndex Score
14 records- 0168US11654656B2Reinforcement sheet, reinforcement member, reinforcement kit, producing method of reinforcement sheet, and producing method of reinforcement memberNITTO DENKO CORP·Filed 2018·Granted May 23, 2023·0 cites·8 claims
- 0267US11654655B2Reinforcement sheet, reinforcement member, reinforcement kit, producing method of reinforcement sheet, and producing method of reinforcement memberNITTO DENKO CORP·Filed 2018·Granted May 23, 2023·0 cites·10 claims
- 0353US11476586B2Radio wave absorbing member, radio wave absorbing structure, and inspection apparatusNITTO DENKO CORP·Filed 2020·Granted Oct 18, 2022·0 cites·8 claims
- 0451US2016215180A1Water-dispersed pressure-sensitive adhesive composition and pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 0546US11964439B2Reinforcement structure and producing method of reinforcement structureNITTO DENKO CORP·Filed 2018·Granted Apr 23, 2024·0 cites·10 claims
- 0646US2013273361A1Active Energy Ray-Curable Pressure-Sensitive Adhesive for Re-Release and Dicing Die-Bonding FilmNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 0745US2012277368A1Aqueous dispersion pressure-sensitive adhesive composition and pressure-sensitive adhesive sheetKOSO MASATSUGU·Filed 2012·Application pending·0 cites
- 0844US2013059960A1Aqueous dispersion pressure-sensitive adhesive composition and pressure-sensitive adhesive sheetKOSO MASATSUGU·Filed 2012·Application pending·0 cites
- 0942US2016222255A1Pressure-sensitive adhesive sheet for mobile electronic devicesNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 1041US2014066557A1Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1140US2012003470A1Active energy ray-curable pressure-sensitive adhesive for re-release and dicing die-bonding filmKAMIYA KATSUHIKO·Filed 2011·Application pending·0 cites
- 1240US2017096563A1Primer composition and composite articleNITTO DENKO CORP·Filed 2015·Application pending·0 cites
- 1339US2016340562A1Adhesive resin composition, adhesive tape, adhesive tape with substrate, and composite articleNITTO DENKO CORP·Filed 2015·Application pending·0 cites
- 1436US2022159884A1Radio wave absorber and kit for radio wave absorberNITTO DENKO CORP·Filed 2020·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →