Inventor
BETTINGER MICHAEL
US7 patents
Patents
7 patentsUS6199743B1Mar 13, 2001
Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies
MICRON TECHNOLOGY INC37 citations91
US6454153B2Sep 24, 2002
Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies
MICRON TECHNOLOGY INC5 citations72
US6357275B1Mar 19, 2002
Apparatus and method for providing mechanically pre-formed conductive leads
MICRON TECHNOLOGY INC5 citations72
US6509205B2Jan 21, 2003
Apparatus and method for providing mechanically pre-formed conductive leads
MICRON TECHNOLOGY INC3 citations61
US6474532B2Nov 5, 2002
Apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies
MICRON TECHNOLOGY INC1 citations61
US6221748B1Apr 24, 2001
Apparatus and method for providing mechanically pre-formed conductive leads
MICRON TECHNOLOGY INC2 citations61
US6504257B1Jan 7, 2003
Apparatus and method for providing mechanically pre-formed conductive leads
MICRON TECHNOLOGY INC0 citations51